SSDs for immersive environments

Goodram Enterprise solutions for immersive environments

In an era of increasing demands for data centre efficiency and optimised energy consumption, traditional cooling systems often fail to keep up with the demands of modern server rooms. Immersion cooling is a breakthrough technology that allows components to significantly reduce their operating temperature by immersing them in a special non-conductive cooling fluid.

Leveraging a strategic partnership with the largest manufacturer of NAND Flash controllers, Phison, we have introduced a new line of Goodram Enterprise powered by Phison server drives, designed to meet the data storage needs of enterprise customers. The two server drive series in this group, namely UltraSeries and DataCore, have been optimised for immersive environments and have passed tests with two dielectric fluids: Shell S5X and Chevron Synfluid PAO 4.

The main characteristics of these fluids are:

High heat capacity
Excellent thermodynamic properties
Lack of electrical conductivity ^[1]

List of Goodram Enterprise powered by Phison drives compatible with immersion cooling

PCIe Enterprise SSD Product Configurations (US15 Series)

PCIe Gen4 x 4 Dual Port/Single Port

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
U.3 2.5"	US10M TLC	Tantalum	15 360	1	7 000 / 7 000	1 600 K / 180 K	MP
	US10M TLC	Tantalum	30 720	1	7 000 / 6 000	1 600 K / 180 K	MP
U.3 2.5"	US10S TLC	Tantalum	12 800	3	7 000 / 7 000	1 600 K / 480 K	MP
	US10S TLC	Tantalum	25 600	3	7 000 / 6 000	1 600 K / 450 K	MP

PCIe Enterprise SSD Product Configurations (US20 Series: U.2)

PCIe Gen5 x 4 Dual Port/Single Port

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
U.2 2.5"	US20M TLC	Tantalum	15 360	1	14 800 / 8 500	2 800 K / 435 K	MP
	US20M TLC	Tantalum	30 720	1	14 800 / 7 600	2 300 K / 280 K	MP
U.2 2.5"	US20S TLC	Tantalum	12 800	3	14 800 / 8 500	2 800 K / 900 K	MP
	US20S TLC	Tantalum	25 600	3	14 800 / 7 600	2 300 K / 630 K	MP

PCIe Enterprise SSD Product Configurations (US20 Series: E3.S)

PCIe Gen5 x 4 Dual Port/Single Port

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
E3.S	US20M TLC	Tantalum	1 920	1	14 800 / 4 300	2 400 K / 155 K	MP
	US20M TLC	Tantalum	3 840	1	14 800 / 8 600	3 300 K / 350 K	MP
	US20M TLC	Tantalum	7 680	1	14 800 / 8 700	3 200 K / 460 K	MP
	US20M TLC	Tantalum	15 360	1	14 800 / 8 500	2 600 K / 430 K	MP
E3.S	US20S TLC	Tantalum	1 600	3	14 800 / 4 300	2 400 K / 400 K	MP
	US20S TLC	Tantalum	3 200	3	14 800 / 8 600	3 300 K / 800 K	MP
	US20S TLC	Tantalum	6 400	3	14 800 / 8 700	3 200 K / 930 K	MP
	US20S TLC	Tantalum	12 800	3	14 800 / 8 500	2 600 K / 920 K	MP

PCIe Enterprise SSD Product Configurations (DC10 Series)

PCIe Gen4 x 4

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
M.2 2280	DC10M TLC	Tantalum	480	1	6 000 / 700	450 K / 25 K	MP
	DC10M TLC	Tantalum	960	1	6 000 / 1 400	750 K / 50 K	MP
	DC10M TLC	Tantalum	1 920	1	6 000 / 1 800	800 K / 60 K	MP
M.2 22110	DC10M TLC	Tantalum	480	1	6 000 / 700	450 K / 25 K	MP
	DC10M TLC	Tantalum	960	1	6 000 / 1 400	750 K / 50 K	MP
	DC10M TLC	Tantalum	1 920	1	6 000 / 1 800	800 K / 60 K	MP
	DC10M TLC	Tantalum	3 840	1	3 700 / 1 700	400 K / 40 K	MP
E1.S	DC10M TLC	Tantalum	480	1	6 500 / 700	450 K / 25 K	MP
	DC10M TLC	Tantalum	960	1	6 800 / 1 400	800 K / 50 K	MP
	DC10M TLC	Tantalum	1 920	1	6 800 / 2 000	900 K / 60 K	MP
	DC10M TLC	Tantalum	3 840	1	6 800 / 1 700	650 K / 70 K	MP

PCIe Enterprise SSD Product Configurations (DC20 Series)

PCIe Gen5 x 4 Single Port

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
E1.S	DC20M TLC	Tantalum	1 920	1	14 000 / 4 200	2 350 K / 160 K	MP
	DC20M TLC	Tantalum	3 840	1	14 000 / 8 300	3 300 K / 220 K	MP
	DC20M TLC	Tantalum	7 680	1	14 000* / 8 300*	2 900 K* / 400 K*	CS: Q1'25
E1.S	DC20S TLC	Tantalum	1 600	3	14 000 / 4 200	2 350 K / 400 K	MP
	DC20S TLC	Tantalum	3 200	3	14 000 / 8 300	3 300 K / 540 K	MP
	DC20S TLC	Tantalum	6 400	3	14 000* / 8 300*	2 900 K* / 800 K*	CS: Q1'25

*Estimated Performance

PCIe Enterprise SSD Product Configurations (DC20F Series)

PCIe Gen5 x 4 Dual Port/Single Port

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
E3.S	DC20F QLC	Tantalum	30 720	0.3	14 600 / 3 000	3000 K / 34 K	CS: 6/B’25
	DC20F QLC	Tantalum	61 440	0.3	14 600 / 3 000	3 000 K / 34 K	CS: Q4’25

PCIe Enterprise SSD Product Configurations (DC25F Series)

PCIe Gen5 x 4 Dual Port/Single Port

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
E3.S	DC25F QLC	Tantalum	122 880	0.3	14 600 / 3 200	3000 K / 35 K	CS: Q4’25
E3.L	DC25F QLC	Tantalum	122 880	0.3	14 600 / 3 200	3 000 K / 35 K	CS: 6/M’25

SATA Enterprise SSD Product Configurations (SD05F Series)

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
2.5"	SD05F TLC	Tantalum	3 840	>0.4	530 / 500	97 K / 20 K	MP
	SD05F TLC	Tantalum	7 680	>0.4	530 / 500	97 K / 14 K	MP
	SD05F TLC	Tantalum	15 360	>0.4	530 / 500	94 K / 10 K	MP

PCIe Enterprise SSD Product Configurations (BS10M Series)

PCIe Gen4 x 4

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
M.2 2280	BS10M TLC	Tantalum	480	1	4 000 / 300	250 K / 15 K	MP
	BS10M TLC	Tantalum	960	1	5 000 / 700	450 K / 30 K	MP

SATA Enterprise SSD Product Configurations (BS05M Series)

Form Factor	Product Series	H/W Pfail	Capacity (GB)	Up to DWPD (5 Years)	Seq. R/W (MB/s)	4K Ran. R/W (IOPS)	Product Status
M.2 2280	BS05M TLC	Tantalum	240	1	530 / 290	60 K / 10 K	MP
	BS05M TLC	Tantalum	480	1	530 / 480	90 K / 15 K	MP
	BS05M TLC	Tantalum	960	1	530 / 500	98 K / 30 K	MP

What are the benefits of liquid cooling in data centres?

Immersion cooling technology is transforming the computing capabilities of today’s data centres. With efficiencies up to 3,000 times greater than traditional air cooling, dielectric fluids open up new possibilities for server room performance ^[2].

While traditional air cooling systems limit the power of server racks to 20-30kW, immersion cooling makes it possible to achieve more than 100kW per rack ^[3]. This is important because new electronics generate significantly more heat than their predecessors^[2]. In response to these challenges, liquid cooling offers:

Stable operating temperatures for high-performance processors
The ability to support IT infrastructures with a density of 40-100 kW per rack ^[4]
Efficient heat removal even under extreme loads

Elimination of HVAC systems and noise reduction

The implementation of immersion cooling leads to a significant optimisation of the data centre infrastructure. First and foremost, it eliminates the need for energy-intensive precision air conditioning systems and fans ^[5]. As a result:

Noise levels in the server room are significantly reduced
Technical staff can work in comfortable acoustic conditions ^[3]
Energy consumption for cooling is reduced by up to 90% ^[2]

Summary

Immersion cooling is a breakthrough solution for modern data centres. First and foremost, the technology offers a significant reduction in operating costs by reducing the energy used for cooling by up to 90% and lowering the PUE to 1.03.

Designed specifically for immersive environments, Goodram Enterprise powered by Phison solutions offer exceptional durability and reliability. Equipped with advanced protection features and designed to operate with a variety of dielectric fluids, these drives significantly enhance data centre performance.

Looking to the future, immersion cooling will play a key role in the transformation of data centres. This technology not only increases computing power density, but also supports the European Green Deal, leading to a more sustainable IT industry. We look forward to playing our part.